2015 International Conference on Innovative Materials and Construction (ICIMC 2015)

2015年創新材料與建築國際會議

Hong Kong June 20-21, 2015

Welcome to the official website of 2015 International Conference on Innovative Materials and Construction (ICIMC 2015). ICIMC 2015 is being organized and will be held in Hong Kong from June 20 to 21, 2015. ICIMC 2015 will provide leading academy and industry scientists a platform to communicate recent advances in Innovative Materials and Construction and an opportunity to establish multilateral collaborations.

The conference proceeding on the International Journal " Applied Mechanics and Materials" [ISSN:1660-9336]" will cover the following research topics:

T1. Concrete prepared from mineral admixtures as partial replacement of cement
T2. Concrete prepared from waste as a substitute for fine aggregate
T3. Innovative coarse aggregate for concrete
T4. Repair materials and chemicals
T5. Precast and prefabricated construction
T6. Sustainable construction

Approximately 100 participants are expected to attend this exciting scientific forum including almost 40 lectures delivered by worldwide known invited speakers and young, talented speakers selected from submitted abstracts.

We are looking forward to seeing you in Hong Kong on June 20-21, 2015!

Publication and Presentation

All registered and presented papers will be published in International Journal "Applied Mechanics and Materials" [ISSN:1660-9336, Trans Tech Publications]. Applied Mechanics and Materials is Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc. http://www.ttp.net/1660-9336.html. The full text is online available via platform www.scientific.net.Trans Tech Publications will provide online camera-ready paper submission system.

If you want to present your research results but do NOT wish to publish a paper, you may simply submit an Abstract to our Registration System.

Latest News

Aug. 11, 2015 Good News! ICIMC 2015 will be held in Hong Kong during June 20-21, 2015!

SAISE Membership

The key values of SAISE membership are technical innovation, access to cutting-edge information, networking opportunities, and exclusive member benefits.

SAISE memberships support SAISE's mission to advance technology for humanity and the profession. At the same time, memberships build a platform to introduce technology careers to students around the world.

As a member of SAISE, you'll receive access to select content, product discounts, and more.

If you are interested in joining SAISE as member, you are welcome to feed back the SAISE Membership Application Form to member@saise.org.

For more details of SAISE membership, see: www.saise.org.

Submission Guide

The submission of ICIMC 2015 will be open after September 10, 2014. Prospective authors are required to write the manuscript according to the template provided below. Only English full paper is acceptable. The conference only accept online submission.

click here to submit your paper

Click the link below to down load the template!

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Contact Info

Miss Echo Nie

Tel: +86-18062000004 or +86-27-86666663 (中文)
Tel:+1-302-444-8432 (USA)
E-mail: icimc@saise.org